Language: Chineseline English

LED chip technology and analysis of differences at home and abroad

Chip is the core component of LED. At present, many domestic and foreign manufacturers of LED chip, and chip classification has no unified standard, according to the power classification, there are a large power and small power; if classified by color, mainly red, green, blue three; if the classification based on the shape, generally divided into square plate, two kinds of wafer; if according to the voltage classification, is divided into low voltage and high voltage DC DC chip chip. Comparison of chip technology at home and abroad, foreign chip technology is new, domestic heavy output of chips is not heavy technology.
Substrate material and wafer growth technology become key
At present, the key to the development of LED chip technology is the substrate material and wafer growth technology. In addition to the traditional sapphire, silicon (Si) and silicon carbide (SiC) substrate materials, Zinc Oxide (ZnO) and gallium nitride (GaN) are also the focus of the current LED chip research. At present, the market most of the sapphire or silicon carbide substrate to the epitaxial growth of wide band gap semiconductor Gan, the two kinds of materials are expensive, and is monopolized by foreign companies, and the price of silicon substrate than sapphire and SiC substrates is much cheaper, can produce greater substrate size, improve the utilization rate of MOCVD in order to improve the yield of the tube core. Therefore, in order to break through the international patent barriers, Chinese research institutions and LED enterprises begin to study from silicon substrate materials.

But the problem is that the high quality silicon and gallium nitride is combined with the technical difficulties of LED chip, a huge mismatch in lattice constant and thermal expansion coefficient and the density of defects caused by crack and high technical problems have long hindered the development in the field of chip.
Undoubtedly, from the substrate point of view, the mainstream substrate is still sapphire and silicon carbide, but silicon has become the future trend of chip development. For the price war is relatively serious China, silicon substrate is more cost and price advantage: the silicon substrate is a conductive substrate, which can not only reduce the die area, can also be a dry etching step, eliminating the epitaxial layer of gallium nitride and silicon sapphire and silicon carbide hardness than low in processing can also save some cost.
At present, most of the LED industry is based on 2 or 4 inches of sapphire substrate, and if silicon nitride technology can be used, at least 75% of the cost of raw materials can be saved. According to Japan Sanken electric company estimates that the cost of production of large size silicon substrate using blue alxga1 LED 90% lower than the sapphire and SiC substrates.


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